{"id":233111,"date":"2024-10-19T15:11:28","date_gmt":"2024-10-19T15:11:28","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60191-6-172011\/"},"modified":"2024-10-25T09:39:37","modified_gmt":"2024-10-25T09:39:37","slug":"bs-en-60191-6-172011","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60191-6-172011\/","title":{"rendered":"BS EN 60191-6-17:2011"},"content":{"rendered":"
IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
6<\/td>\n | English \n CONTENTS <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 4 Terminal position numbering <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 5 Drawings Figures \n Figure 1 \u2013 Individual stackable package, P-FBGA (cavity-up) <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | Figure 2 \u2013 Individual stackable package, P-FBGA (cavity-down) <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | Figure 3 \u2013 Individual stackable package, P-FLGA (cavity-up) <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | Figure 4 \u2013 Stacked package outline, P-PFBGA (cavity-up BGA and cavity-up BGA) <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | Figure 5 \u2013 Stacked package outline, P-PFBGA \n(cavity-down BGA and cavity-down BGA) <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Figure 6 \u2013 Stacked package outline, \nP-PFBGA (cavity-down BGA + cavity-up LGA) <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Figure 7 \u2013 Stacked package outline, P-PFLGA (cavity-up LGA + cavity-up BGA) <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | Figure 8 \u2013 Functional gauge Figure 9 \u2013 Pattern of terminal position area <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 6 Dimensions 6.1 Group 1 Tables \n Table 1 \u2013 Dimensions, Group 1 <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | 6.2 Group 2 Table 2 \u2013 Dimensions Group 2 <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | 6.3 Combination of D, E, MD, and ME Table 3 \u2013 Combination of D, E, MD, and ME, e = 0,80 \nmm pitch FBGA and FLGA <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | Table 4 \u2013 Combination of D, E, MD, and ME, e = 0,65 \nmm pitch FBGA and FLGA <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | Table 5 \u2013 Combination of D, E, MD, and ME, e = 0,50 \nmm pitch FBGA and FLGA <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | Table 6 \u2013 Combination of D, E, MD, and ME, e = 0,40 \nmm pitch FBGA an FLGA <\/td>\n<\/tr>\n | ||||||
28<\/td>\n | Table 7 \u2013 Combination of D, E, MD, and ME, e = 0,30 \nmm pitch FLGA <\/td>\n<\/tr>\n | ||||||
29<\/td>\n | 7 Dimension table Table 8 \u2013 Dimension table <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)<\/b><\/p>\n |