{"id":691205,"date":"2024-11-06T05:24:48","date_gmt":"2024-11-06T05:24:48","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/tia-455-1291996-r2014\/"},"modified":"2024-11-06T05:24:48","modified_gmt":"2024-11-06T05:24:48","slug":"tia-455-1291996-r2014","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/tia\/tia-455-1291996-r2014\/","title":{"rendered":"TIA-455-129:1996 (R2014)"},"content":{"rendered":"

This procedure covers ESD stressing of packaged optoelectronic
\ncomponents only and is not applicable to purely electronic
\ncomponents. For purposes of this document a packaged optoelectronic
\ncomponents includes assembled packages which contain one or more
\noptoelectronic chips one or all of whose chip terminals are
\ndirectly connected to the package terminals. For semiconductor
\nlasers this package will, in most cases, include a rear facet
\nmonitor and may include some monitoring circuitry.<\/p>\n

This document applies t the ESD testing of any module circuitry,
\nincluding the rear facet monitor as well as the laser chip, since
\nsuch circuitry is an integral part of the laser package. This
\ndocument applies to all multi-frequency and single frequency laser
\ndevices that utilize semiconductor technology. Therefore, it
\nincludes, but is not limited to, Fabry-Perot lasers, distributed
\nfeedback (DFB) lasers, distributed Bragg reflector (DBR) lasers,
\nand optoelectronic amplifiers and modulators. This document
\nspecifically exludes lasers which utilize only active elements
\nother than semiconductor devices (for example, He-Ne, Ar, CO2, or
\nNd: YAG lasers) The document also excludes packaged modules which
\ncontain optoelectronic chips whose terminals are connected only to
\ninternal nodes. Such devices are more properly treated as Hybrid
\nICs for the purpose of ESD testing.<\/p>\n

Finally, it should be noted that this document covers only the
\napplication of Human Body Model (HBM) ESD testing. The application
\nof other types of ESD such as the Charged Device Model (CDM) and
\nthe Field Induced Model (FIM) require different types of stressing
\napparatus and different procedures. In Addition, these other ESD
\nstressing models tend to produce different types of failure
\nmechanisms in the components under test.<\/p>\n","protected":false},"excerpt":{"rendered":"

Procedures for Applying Human Body Model Electrostatic Discharge Stress to Package Optoelectronic Components<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
TIA<\/b><\/a><\/td>\n1996<\/td>\n28<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":691215,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2646],"product_tag":[],"class_list":{"0":"post-691205","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-tia","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/691205","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/691215"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=691205"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=691205"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=691205"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}