{"id":410770,"date":"2024-10-20T05:41:56","date_gmt":"2024-10-20T05:41:56","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-cen-iso-astm-tr-529062022\/"},"modified":"2024-10-26T10:30:02","modified_gmt":"2024-10-26T10:30:02","slug":"bsi-pd-cen-iso-astm-tr-529062022","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-cen-iso-astm-tr-529062022\/","title":{"rendered":"BSI PD CEN ISO\/ASTM\/TR 52906:2022"},"content":{"rendered":"
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
4<\/td>\n | European foreword Endorsement notice <\/td>\n<\/tr>\n | ||||||
6<\/td>\n | Foreword <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | Introduction <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 4 Abbreviated terms <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 5 Typical AM flaws <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 6 Procedure to produce replicas 7 Seeding approaches 7.1 General <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 7.2 CAD seeding <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 7.3 AM process manipulation replicas 7.3.1 General <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 7.3.2 Entrapped unsintered powder 7.3.3 Manual insertion of high-density inclusions 7.4 Post-production mechanical introduction of replicas <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 7.5 Significance and use for homogeneity <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | 8 AM process manipulation for L-PBF and L-DED 8.1 General 8.2 AM machine parameter manipulation <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | 8.3 Applicable flaw-seeding approaches as a function of desired flaw type 8.3.1 General 8.3.2 Porosity or voids (increased power density) 8.3.3 Surface-connected flaws <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | 8.4 Applicable flaw-seeding approach as a function of AM process <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | 8.5 Applicable flaw-seeding approach as a function of AM material 8.5.1 General <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | 8.5.2 High-density inclusions 9 Applicable flaw-seeding approach as a function of post processing machining 9.1 General 9.2 Mechanical machining 9.3 Electrode discharge machining replicas 9.4 Laser drilling replicas <\/td>\n<\/tr>\n | ||||||
28<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Additive manufacturing. Non-destructive testing. Intentionally seeding flaws in metallic parts<\/b><\/p>\n |