{"id":401119,"date":"2024-10-20T04:54:30","date_gmt":"2024-10-20T04:54:30","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/ieee-1704-2021\/"},"modified":"2024-10-26T08:41:48","modified_gmt":"2024-10-26T08:41:48","slug":"ieee-1704-2021","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/ieee\/ieee-1704-2021\/","title":{"rendered":"IEEE 1704-2021"},"content":{"rendered":"
New IEEE Standard – Active. This standard is an extension to IEEE Std 1703(TM). Physical hardware interfaces and signals, such as logical interface and power (digital and mains), that link metrology devices to communications modules via the USB physical layer are specified in this standard. The communication module described in this standard is not integral (not on the same circuit board) with the metrology registers (circuit board) of the assembly. However, the module is envisioned to partner with a device implementing measurement registers (energy, demand load, power quality and related quantities) that are semantically modeled using IEEE Std 1377\u2122, and encapsulated for communication using IEEE Std 1703(TM)application layer messages.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
1<\/td>\n | IEEE Std 1704\u2122-2022 Front Cover <\/td>\n<\/tr>\n | ||||||
4<\/td>\n | Important Notices and Disclaimers Concerning IEEE Standards Documents <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | Participants <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | Introduction <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | Contents <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | List of Figures <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | List of Tables <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 1. Overview 1.1 Scope 1.2 Purpose 1.3 Word usage <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 2. Normative references <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 3. Definitions, acronyms, and abbreviations 3.1 Definitions <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 3.2 Acronyms and abbreviations 4. Reference architecture 4.1 Foundation communication architecture <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 4.2 Conceptual logical configurations <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 5. Conformance requirements 5.1 General requirements <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 5.2 USB 2.0 implementation requirements <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | 5.3 Power line communication implementation <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | 5.4 Additional requirements <\/td>\n<\/tr>\n | ||||||
35<\/td>\n | 6. IEEE 1704 Device to internal IEEE 1704 Communication Module interface 6.1 Overview 6.2 Interface architecture <\/td>\n<\/tr>\n | ||||||
36<\/td>\n | 6.3 Interface block diagram <\/td>\n<\/tr>\n | ||||||
37<\/td>\n | 6.4 Implementation requirements <\/td>\n<\/tr>\n | ||||||
38<\/td>\n | 6.5 Layer 7\u2014Application layer 6.6 Layer 6\u2014Presentation layer <\/td>\n<\/tr>\n | ||||||
39<\/td>\n | 6.7 Layer 5\u2014Session layer 6.8 Layer 4\u2014Transport layer 6.9 Layer 3\u2014Network layer 6.10 Layer 2\u2014Data link layer 6.11 Layer 1\u2014Physical layer <\/td>\n<\/tr>\n | ||||||
41<\/td>\n | Annex A (informative)Bibliography <\/td>\n<\/tr>\n | ||||||
42<\/td>\n | Back cover <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" IEEE Standard for Utility Industry End Device Communications Module<\/b><\/p>\n |