{"id":233526,"date":"2024-10-19T15:13:22","date_gmt":"2024-10-19T15:13:22","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60749-432017\/"},"modified":"2024-10-25T09:43:34","modified_gmt":"2024-10-25T09:43:34","slug":"bs-en-60749-432017","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60749-432017\/","title":{"rendered":"BS EN 60749-43:2017"},"content":{"rendered":"

IEC 60749-43:2017 gives guidelines for reliability qualification plans of semiconductor integrated circuit products (ICs). This document is not intended for military- and space-related applications.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nNational foreword <\/td>\n<\/tr>\n
7<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
9<\/td>\nFOREWORD <\/td>\n<\/tr>\n
11<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
12<\/td>\n1 Scope
2 Normative references <\/td>\n<\/tr>\n
13<\/td>\n3 Terms and definitions
4 Product categories and applications <\/td>\n<\/tr>\n
14<\/td>\n5 Failure
5.1 Failure distribution
Tables
Table 1 \u2013 Examples of product categories <\/td>\n<\/tr>\n
15<\/td>\n5.2 Early failure
5.2.1 Description
Figures
Figure 1 \u2013 Bathtub curve <\/td>\n<\/tr>\n
16<\/td>\n5.2.2 Early failure rate
Figure 2 \u2013 Failure process of IC manufacturing lots during the early failure period <\/td>\n<\/tr>\n
17<\/td>\nFigure 3 \u2013 Weibull conceptual diagram of the early failure rate <\/td>\n<\/tr>\n
19<\/td>\n5.2.3 Screening
Figure 4 \u2013 Example of a failure ratio: \u03b1 (in hundreds) and the number of failures for CL of 60\u00a0% <\/td>\n<\/tr>\n
20<\/td>\nFigure 5 \u2013 Screening and estimated early fail rate in Weibull diagram <\/td>\n<\/tr>\n
21<\/td>\nFigure 6 \u2013 Bathtub curve setting the point immediately after production as the origin <\/td>\n<\/tr>\n
22<\/td>\n5.3 Random failure
5.3.1 Description
5.3.2 Mean failure rate
Figure 7 \u2013 Bathtub curve setting the point after screening as the origin <\/td>\n<\/tr>\n
23<\/td>\nFigure 8 \u2013 Conceptual diagram of calculation method for the mean failure rate from the exponential distribution <\/td>\n<\/tr>\n
24<\/td>\nFigure 9 \u2013 Conceptual diagram of calculation method for the mean failure rate as an extension of early failure <\/td>\n<\/tr>\n
25<\/td>\n5.4 Wear-out failure
5.4.1 Description
5.4.2 Wear-out failure rate <\/td>\n<\/tr>\n
26<\/td>\nFigure 10 \u2013 Conceptual diagram of the wear-out failure
Figure 11 \u2013 Conceptual diagram describing the concept of the acceleration test <\/td>\n<\/tr>\n
28<\/td>\n6 Reliability test
6.1 Reliability test description
6.2 Reliability test plan
6.2.1 Procedures for creating a reliability test plan <\/td>\n<\/tr>\n
30<\/td>\nFigure 12 \u2013 Concept of the reliability test in a Weibull diagram (based on sample size)
Table 2 \u2013 Cumulative failure probability 0,1\u00a0% over 10 years [\u00d710\u20136] for the third, fifth and seventh years <\/td>\n<\/tr>\n
31<\/td>\n6.2.2 Estimation of the test time required to confirm the TDDB from the number of test samples <\/td>\n<\/tr>\n
32<\/td>\n6.2.3 Estimation of the number of samples required to confirm the TDDB from the test time <\/td>\n<\/tr>\n
33<\/td>\n6.3 Reliability test methods
Figure 13 \u2013 Concept of the reliability test in a Weibull diagram (based on test time) <\/td>\n<\/tr>\n
34<\/td>\nFigure 14 \u2013 Difference in sampling sizes according tothe m value (image) <\/td>\n<\/tr>\n
35<\/td>\nTable 3 \u2013 Major reliability (life) test methods and purposes <\/td>\n<\/tr>\n
36<\/td>\n6.4 Acceleration models for reliability tests
6.4.1 Arrhenius model
Table 4 \u2013 Examples of the number of test samples and the test time in typical reliability (life) test methods <\/td>\n<\/tr>\n
37<\/td>\n6.4.2 V-model:
6.4.3 Absolute water vapor pressure model
6.4.4 Coffin-Manson model
7 Stress test methods <\/td>\n<\/tr>\n
38<\/td>\n8 Supplementary tests
Table 5 \u2013 LTPD sampling table for acceptance number Ac = 0
Table 6 \u2013 Major reliability (strength) test methods and purposes <\/td>\n<\/tr>\n
39<\/td>\n9 Summary table of assumptions
Table 7 \u2013 Supplementary tests <\/td>\n<\/tr>\n
40<\/td>\nTable 8 \u2013 Accelerating factors, calculation formulae and numerical valuesa <\/td>\n<\/tr>\n
41<\/td>\n10 Summary <\/td>\n<\/tr>\n
42<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Semiconductor devices – Mechanical and climatic test methods – Guidelines for IC reliability qualification plans<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2017<\/td>\n44<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":233531,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[573,2641],"product_tag":[],"class_list":{"0":"post-233526","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-31-080-01","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/233526","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/233531"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=233526"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=233526"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=233526"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}