IEC 62615:2010 defines a method for pulse testing to evaluate the voltage current response of the component under test and to consider protection design parameters for electro-static discharge (ESD) human body model (HBM). This technique is known as transmission line pulse (TLP) testing. This document establishes a methodology for both testing and reporting information associated with transmission line pulse (TLP) testing. The scope and focus of this document pertains to TLP testing techniques of semiconductor components. This document should not become alternative method of HBM test standard such as IEC 60749-26. The purpose of the document is to establish guidelines of TLP methods that allow the extraction of HBM ESD parameters on semiconductor devices. This document provides the standard measurement and procedure for the correct extraction of HBM ESD parameters by using TLP.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 4<\/td>\n | English FOREWORD <\/td>\n<\/tr>\n | ||||||
| 6<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | 1 Scope and object 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | 4 Test apparatus 4.1 General <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | 4.2 Oscilloscope 4.3 Voltage probe 4.4 Current probe 4.5 Transmission line 4.6 High voltage power supply 4.7 High voltage switch 4.8 Attenuator 4.9 Rise time filter <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 5 TLP waveform parameters 5.1 Pulse characteristics 5.2 Pulse plateau 5.3 Pulse width Table 1 \u2013 TLP current and voltage pulse parameters <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 5.4 Rise time 5.5 Fall time 5.6 Maximum peak current overshoot Figures Figure 1 \u2013 TLP waveform parameter illustration for pulse width rise time and fall time (parameters apply to both voltage and current TLP waveforms) Figure 2 \u2013 Illustration of maximum peak current overshoot <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 5.7 Maximum current ringing duration 5.8 Maximum peak voltage overshoot 5.9 Maximum voltage ringing duration 5.10 Measurement window 6 Test requirements and procedures 6.1 Error correction 6.2 Tester error correction methodology Figure 3 \u2013 Illustration of maximum peak voltage overshoot <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 6.3 Tester verification methodology <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 6.4 TLP test procedure <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | Figure 4 \u2013 Flow diagram for the TLP component test procedure Figure 5 \u2013 Illustration of TLP pulse sequence <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 7 Failure criteria 7.1 General information on failure criteria 7.2 Leakage current measurement 7.3 Leakage test voltage 7.4 Documentation <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | Annex A (informative) TLP design guidelines <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | Figure A.1 \u2013 Current source TLP method Table A.1 \u2013 TLP methodologies and parameters <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | Figure A.2 \u2013 Time domain reflectometer (TDR) TLP Figure A.3 \u2013 Time domain reflectometer (TDR) TLP (with balun and wafer probe) <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | Figure A.4 \u2013 Time domain transmission (TDT) TLP Figure A.5 \u2013 Time domain reflection and transmission <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level<\/b><\/p>\n |