IEC 60115-8-1:2014 is applicable to the drafting of detail specifications for fixed surface mount (SMD) low-power film resistors in rectangular chip shape (styles RR) or in cylindrical MELF shape (styles RC) classified to level G, which is defined in IEC 60115-8:2009, 1.5 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals. This edition includes the following significant technical changes with respect to the previous edition: – It includes minor revisions related to tables, figures and references. – Dedication to resistors of product classification level G, which is for general electronic equipment, typically operated under benign or moderate environmental conditions, like e.g. consumer products, or telecommunication user terminals. – Implementation of the zero defect policy with the application of the single assessment level EZ in all test schedules. – Substitution of the temperature coefficient of resistance (TCR), specified over the full defined temperature range, for the inferior and less significant temperature characteristic. – Adition of a test for the immunity against electrostatic discharge. – Implementation of the concept of stability classes with coordinated requirements to the performance at all prescribed tests. – Addition of information relevant for the component user in his assembly process. – Addition of an Annex providing special provisions for 0 resistors (jumpers), which may be part of a range of products covered by a detail specification derived from this blank detail specification.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 4<\/td>\n | Foreword Endorsement notice <\/td>\n<\/tr>\n | ||||||
| 6<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 0 Introduction 0.1 Scope of this blank detail specification 0.2 Function of this blank detail specification <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 0.3 Identification of the detail specification and the resistor <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 3 Terms and definitions 4 Characteristics and ratings 4.1 General 4.2 Dimensions Figures Figure 1 \u2013 Outline and dimensions <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 4.3 Ratings Tables Table 1 \u2013 Styles and dimensions Table 2 \u2013 Climatic categories <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | Figure 2 \u2013 Derating curve Table 3 \u2013 Ratings <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 4.4 Resistance range and tolerance on resistance 5 Tests and test severities Table 4 \u2013 Temperature coefficients, tolerances and resistance ranges for climatic category … \/ … \/ … <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 5.1 Insulation resistance 5.2 Voltage proof 5.3 Variation of resistance with temperature 5.4 Short time overload <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | 5.5 Temperature rise 5.6 Solderability 5.7 Resistance to soldering heat 5.8 Rapid change of temperature Table 5 \u2013 Short time overload duration <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | 5.9 Climatic sequence 5.9.1 General 5.9.2 Climatic sequence, dry heat 5.9.3 Climatic sequence, cold 5.9.4 Climatic sequence, low air pressure <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | 5.9.5 Climatic sequence, damp heat, cyclic 5.9.6 Climatic sequence, DC load 5.9.7 Climatic sequence, final measurements 5.10 Damp heat, steady state test Table 6 \u2013 Remaining cycles of damp heat, cyclic test Table 7 \u2013 Damp heat steady state test duration <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | 5.11 Endurance at 70 C 5.12 Endurance at upper category temperature 5.13 Component solvent resistance test 5.14 Solvent resistance of marking test 5.15 Shear test <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | 5.16 Substrate bending test 5.17 Flammability 5.18 Electrostatic discharge (ESD) test Table 8 \u2013 Shear test force <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | Table 9 \u2013 ESD test voltages <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | 6 Performance requirements 6.1 Limits for change of resistance at tests 6.2 Insulation resistance Table 10 \u2013Limits for change of resistance <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | 6.3 Variation of resistance with temperature 6.4 Temperature rise 6.5 Solderability 6.6 Flammability Table 11 \u2013 Temperature coefficients and permissible change of resistance <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | 7 Marking, packaging and ordering information 7.1 Marking of the component 7.2 Packaging 7.3 Marking of the packaging 7.4 Ordering information <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | 8 Additional information 8.1 General 8.2 Storage and transportation 8.3 Substrate for assembly 8.4 Soldering process <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | 8.5 Use of cleaning agents or solvents 8.6 Coating or potting after assembly 9 Quality assessment procedures 9.1 General 9.1.1 100 % test <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | 9.1.2 Certificate of conformity (CoC) 9.1.3 Certified test records of released lots 9.2 Qualification approval 9.3 Maintenance of a qualification approval 9.3.1 Quality conformance inspection 9.3.2 Non-conforming specimen <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | Table 12 \u2013 Test schedule for qualification approval <\/td>\n<\/tr>\n | ||||||
| 36<\/td>\n | Table 13 \u2013 Test schedule for quality conformance inspection <\/td>\n<\/tr>\n | ||||||
| 41<\/td>\n | Annex A (normative) 0 \u03a9 resistors (jumper) A.1 General A.2 Characteristics and ratings A.3 Tests and test severities Table A.1 \u2013 Ratings for 0 \u03a9 resistors <\/td>\n<\/tr>\n | ||||||
| 42<\/td>\n | A.4 Performance requirements A.5 Marking, packaging and ordering information A.6 Additional information A.7 Quality assessment procedures A.7.1 Test schedule for qualification approval A.7.2 Test schedule for quality conformance inspection <\/td>\n<\/tr>\n | ||||||
| 44<\/td>\n | Annex B (informative) Letter symbols and abbreviations B.1 Letter symbols <\/td>\n<\/tr>\n | ||||||
| 45<\/td>\n | B.2 Abbreviations <\/td>\n<\/tr>\n | ||||||
| 46<\/td>\n | Annex X (informative) Cross-reference for references to the prior revision of this specification <\/td>\n<\/tr>\n | ||||||
| 47<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Fixed resistors for use in electronic equipment – Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G<\/b><\/p>\n |