IEEE 1573 2004
$61.75
IEEE Recommended Practice for Electronic Power Subsystems: Parameters, Interfaces, Elements, and Performance
Published By | Publication Date | Number of Pages |
IEEE | 2004 | 124 |
New IEEE Standard – Active. A technical basis for implementation of electronic power subsystems is provided in this recommended practice. It is intended for electronic systems engineers and integrators, electronic power subsystem designers and integrators, as well as power element manufacturers and suppliers. It addresses system-level issues in element or subsystem integration, adaptation, and accommodation. It also defines system-level interface parameters, test methods, and test conditions. It provides for a systems engineering approach to acquisition, adaptation, and integration of electronic power subsystems, facilitates and promotes a modular approach to element or subsystem integration, and enables effective communication between the end users of power electronics and their manufacturers or suppliers.
PDF Catalog
PDF Pages | PDF Title |
---|---|
1 | Cover |
2 | IEEE Recommended Practice for Electronic Power Subsystems: Parameters, Interfaces, Elements, and Performance Introduction |
5 | Participants |
6 | Contents |
7 | 1. Overview |
10 | 1.1 Scope 1.2 Purpose |
11 | 1.3 Organization of this recommended practice 2. References |
12 | 3. Definitions, abbreviations, acronyms, and symbols 3.1 Definitions 3.2 Abbreviations, acronyms, and symbols |
14 | 4. Element-level parameters |
16 | 4.1 Set point voltage accuracy 4.2 Maximum power dissipation 4.3 Contact resistance 4.4 Input undervoltage protection 4.5 Input overvoltage protection |
17 | 4.6 Overtemperature shutdown |
18 | 4.7 Reverse voltage protection |
19 | 4.8 Turn-on time |
20 | 4.9 Regulation, combined |
21 | 4.10 Regulation effects due to aging 4.11 Lightning 4.12 Surge 4.13 Sag 5. Electronic power subsystems |
22 | 5.1 Interface definition 5.2 Requirements definition |
25 | 5.3 Architectural considerations |
26 | 5.4 System interaction |
31 | 6. Electrical interface parameters |
32 | 6.1 Status monitoring |
33 | 6.2 Supervisory control 6.3 Built-in-test 6.4 Electromagnetic compatibility/electromagnetic interference 7. Mechanical interface parameters |
36 | 7.1 Packaging |
37 | 7.2 Center of gravity |
38 | 7.3 Cooling or thermal energy dissipation process |
39 | 8. Environmental interface parameters |
40 | 8.1 Thermal |
41 | 8.2 Resistance to contaminants 8.3 Sand and dust 8.4 Explosive atmosphere |
42 | 8.5 Acoustics |
43 | 8.6 Radiation |
44 | 9. System effectiveness interface parameters |
46 | 9.1 Qualification requirements 9.2 Quality assurance |
47 | 9.3 Acceptance testing 9.4 Compliance information |
48 | 9.5 Logistics 9.6 Configuration management |
49 | 9.7 Obsolescence 9.8 Discontinuance 9.9 Production line certification 9.10 Warranty 10. System integration |
50 | 10.1 System interaction 10.2 Protection and sensing |
54 | 10.3 Output sequencing and clamping |
56 | 10.4 Supervisory/status monitoring, control, and software implementation |
57 | 10.5 System reliability |
58 | 10.6 Logistics |
61 | 11. System adaptation |
62 | 11.1 Electrical interface adaptations |
70 | 11.2 Mechanical interface adaptation |
80 | 11.3 Environmental interface adaptation |
82 | 11.4 System effectiveness interface adaptation |
89 | 11.5 Adaptation analysis techniques |
94 | Annex A—(informative) Bibliography |
95 | Annex B—(informative) Performance |
98 | Annex C—(informative) Parameter index |
101 | B.1. Electrical interface performance B.2. Mechanical interface performance |
103 | B.3. Environmental interface performance B.4. System effectiveness performance |
112 | Annex D (informative)—Radiation environments |
113 | D.1. Radiation environmental/definition D.2. Definition of terms D.3. Radiation environments |
120 | D.4. Radiation design considerations |
123 | D.5. Radiation testing |