IEC 60191-6-22:2012
$33.15
Normalisation mécanique des dispositifs à semiconducteurs – Partie 6-22 : règles générales pour la préparation des dessins d’encombrement des dispositifs à semiconducteurs à montage en surface – Guide de conception pour les boîtiers matriciels à billes et à pas fins en silicium et boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FBGA et S-FLGA)
| Published By | Publication Date | Number of Pages |
| IEC | 2012-12-11 | 38 |
| Published Code | IEC |
|---|---|
| Published By | International Electrotechnical Commission |
| Publication Date | 2012-12-11 |
| Pages Count | 38 |
| Language | France |
| Edition | 1.0 |
| File Size | 1.0 MB |
| ICS Codes | 31.080.01 - Semiconductor devices in general |
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