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BSI PD IEC/TR 62866:2014

BSI PD IEC/TR 62866:2014

$215.11

Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

Published By Publication Date Number of Pages
BSI 2014 96
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This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

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BSI PD IEC/TR 62866:2014
$215.11