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BSI 23/30473669 DC 2023

BSI 23/30473669 DC 2023

$13.70

BS ISO/IEC 30129 AMD 2. Information technology. Telecommunications bonding networks for buildings and other structures

Published By Publication Date Number of Pages
BSI 2023 50
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PDF Catalog

PDF Pages PDF Title
3 HORIZONTAL_STD
FUNCTION_EMC
FUNCTION_ENV
FUNCTION_QUA
FUNCTION_SAFETY
4 CONTENTS
9 Scope
Normative references
10 Terms, definitions and abbreviations
3.1 Terms and definitions
12 3.2 Abbreviations
13 Conformance
14 Overview of bonding networks
15 Selection of the telecommunications bonding network approach
6.1 Assessment of the impact of the telecommunications bonding network on the interconnection of telecommunications equipment
17 6.2 Telecommunications bonding networks
6.3 Telecommunications bonding network performance
6.3.1 General
6.3.1.1 Protective bonding networks
18 6.3.1.2 Dedicated telecommunications bonding networks
6.3.2 Requirements
6.3.2.1 General requirements
6.3.2.2 Protective bonding networks
19 6.3.2.3 Dedicated bonding networks
6.3.3 DC resistance measurements
6.3.3.1 General
20 6.3.3.2 Dedicated bonding networks
Common features
7.1 General
7.2 Protective bonding networks
7.2.1 Protective bonding network conductors (PBNCs)
7.2.2 Main earthing terminal (MET)
7.3 Telecommunications entrance facility (TEF)
21 7.4 Telecommunications bonding network components
7.4.1 Telecommunications bonding network conductors
7.4.1.1 Materials
7.4.1.2 Installation
7.4.2 Telecommunications bonding network connections
22 7.5 Cabinets, frames and racks
7.5.1 External connections to a bonding network
7.5.1.1 Requirements
7.5.1.2 Recommendations
23 7.5.2 Rack bonding conductors
7.5.2.1 Rack bonding conductors for d.c. resistance control
7.5.2.2 Rack bonding conductors (RBC) for impedance control
7.5.2.2.1 Requirements
7.5.2.2.2 Recommendations
7.5.3 Internal connections
7.5.3.1 Requirements
OLE_LINK1
OLE_LINK2
24 7.5.3.2 Structural bonding within cabinets, frames and racks
25 7.6 Miscellaneous bonding connections
7.6.1 General
7.6.2 Bonding conductors for d.c. resistance control
7.6.3 Bonding conductors for impedance control
7.6.3.1 Requirements
7.6.3.2 Recommendations
7.7 Documentation
26 Dedicated telecommunications bonding network
8.1 General
27 8.2 Components
8.2.1 Primary bonding busbar (PBB)
8.2.2 Secondary bonding busbar (SBB)
28 8.2.3 Bonding conductors for d.c. resistance control
8.2.3.1 Telecommunications bonding conductor (TBC)
8.2.3.2 Telecommunications bonding backbone (TBB)
8.2.3.2.1 Requirements
8.2.3.2.2 Recommendations
29 8.2.3.3 Backbone bonding conductor (BBC)
8.2.4 Bonding conductors for impedance control
8.2.4.1 Telecommunications bonding backbone (TBB)
8.2.4.1.1 Requirements
8.2.4.1.2 Recommendations
8.2.4.2 Backbone bonding conductor (BBC)
8.2.4.2.1 Requirements
8.2.4.2.2 Recommendations
8.3 Implementation
8.3.1 Primary bonding busbar (PBB)
8.3.1.1 General
30 8.3.1.2 Bonding to the PBB
8.3.2 Secondary bonding busbar (SBB)
8.3.2.1 General
8.3.2.2 Bonding to the secondary bonding busbar
31 8.3.3 Telecommunications bonding conductor (TBC)
8.3.4 Telecommunications bonding backbone (TBB)
32 8.3.5 Backbone bonding conductor (BBC)
8.3.6 Bonds to continuous conductive pathway systems
8.3.7 Bonds to structural metal
Local telecommunications bonding networks in conjunction with protective bonding networks
9.1 Bonding for local distribution
9.1.1 Star protective bonding networks
34 9.1.2 Ring protective bonding networks
35 9.2 Telecommunications bonding conductors
9.2.1 Bonding conductors for d.c. resistance control
9.2.1.1 Requirements
9.2.1.2 Recommendations
9.2.2 Bonding conductors for impedance control
9.2.2.1 Requirements
9.2.2.2 Recommendations
36 9.3 Bonding for areas of telecommunications equipment concentration
Local telecommunications bonding networks in conjunction with dedicated telecommunications bonding networks
10.1 Bonding for areas of telecommunications equipment concentration
10.1.1 Requirements
10.1.2 Recommendations
10.1.3 Cabinets, frames and racks
10.2 Telecommunications equipment bonding conductors (TEBC)
10.2.1 TEBC for d.c. resistance control
37 10.2.2 TEBC for impedance control
10.2.2.1 Requirements
10.2.2.2 Recommendations
10.2.3 Implementation
Mesh bonded networks
11.1 General
38 11.2 Mesh bonding alternatives
11.2.1 Local mesh bonding (MESH-IBN) networks
11.2.1.1 General
39 11.2.1.2 Requirements
40 11.2.1.3 Recommendations
11.2.2 MESH-BN
11.2.2.1 General
11.2.2.2 Requirements
41 11.3 Bonding conductors of a mesh bonding network
11.3.1 Requirements
11.3.2 Recommendations
11.4 Bonding conductors to the mesh bonding network
42 11.5 Supplementary bonding grid (SBG)
11.6 System reference potential plane (SRPP)
11.6.1 General
43 11.6.2 Access floors
11.6.2.1 Requirements
11.6.2.2 Recommendations
44 11.6.3 Transient suppression plate (TSP)
45 Annex A (normative)Maintenance of telecommunications bonding network performance
A.1 General
A.2 Periodic activity
A.2.1 Schedule
A.2.2 Implementation
A.2.2.1 Protective bonding network
A.2.2.2 Dedicated bonding network
A.2.2.3 Assessment of results
A.3 Causes of performance deterioration
A.3.1 Galvanic corrosion
46 A.3.2 Requirements
47 Annex B (normative)Bonding conductor cross-sectional area
48 Annex C (infomative)Alternative terminology
49 Bibliography

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BSI 23/30473669 DC 2023
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