BSI 19/30350992 DC:2019 Edition
$13.70
BS EN IEC 60749-41. Semiconductor devices. Mechanical and climatic test methods – Part 41. Standard reliability testing methods of non-volatile memory devices
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 21 |
| Status | Definitive |
|---|---|
| Pages | 21 |
| Publication Date | 2019-08-29 |
| Standard Number | 19/30350992 DC |
| Title | BS EN IEC 60749-41. Semiconductor devices. Mechanical and climatic test methods – Part 41. Standard reliability testing methods of non-volatile memory devices |
| Identical National Standard Of | IEC 60749-41 Ed.1.0 |
| Descriptors | Integrated circuits, Solderability testing, Strength of materials, Dimensional measurement, Classification systems, Specimen preparation, Accelerated testing, Pull-out tests, Mass spectrometry, Mechanical testing, Thermal-shock tests, Storage, Electrical testing, Visual inspection (testing), Torsion testing, Low-pressure tests, Defects, Endurance testing, Test equipment, Test specimens, Electric terminals, Temperature measurement, Environmental testing, Marking, Shear testing, Leak tests, Electronic equipment and components, Bonding, Stress, Moisture measurement, Vibration testing, Radioactive tracer methods, Thermal testing, Semiconductor devices, Fire tests, Damp-heat tests, Flammability, Testing conditions |
| Publisher | BSI |
| Committee | EPL/47 |
| ICS Codes | 31.080.01 - Semiconductor devices in general |
