BS EN IEC 60938-1:2021
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Fixed inductors for electromagnetic interference suppression – Generic specification
Published By | Publication Date | Number of Pages |
BSI | 2021 | 38 |
This International Standard applies to inductors designed for electromagnetic interference suppression intended for use within all kind of electric and electronic equipment. In this Generic Specification normative reference, terms and definitions are given. It also prescribes General requirements and the suitable test and measurement procedures for interference suppression inductors.
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
5 | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications |
7 | English CONTENTS |
9 | FOREWORD |
11 | INTRODUCTION |
12 | Figure 1 – Relevant specification |
13 | 1 Scope 2 Normative references Figures |
14 | 3 Terms, definitions and conventions 3.1 Terms and definitions |
16 | 3.2 Conventions 4 General requirements 4.1 General |
17 | 4.2 Preferred values 4.2.1 General 4.2.2 Rated current 4.2.3 Temperature de-rated current 4.3 Information to be given in a detail specification 4.3.1 General 4.3.2 Outline drawing and dimensions Figure 2 – Relation between ambient temperature and applied current |
18 | 4.3.3 Mounting 4.3.4 Ratings and characteristics 4.4 Insulated inductors 4.5 Marking |
19 | 5 Tests and measurement procedures 5.1 General 5.2 Standard atmospheric conditions 5.3 Visual examination 5.4 Insulation resistance Tables Table 1 – Standard atmospheric conditions |
20 | 5.5 Voltage test Table 2 – Measuring voltage for insulation resistance testing |
21 | 5.6 Inductance 5.7 Resistance 5.8 Insertion loss 5.9 Temperature rise 5.10 Impulse voltage |
22 | 5.11 Endurance 5.12 Robustness of terminations 5.13 Vibration 5.14 Shock |
23 | 5.15 Resistance to soldering heat |
24 | Figure 3 – Temperature profile for reflow simulation |
25 | 5.16 Solderability 5.16.1 General 5.16.2 Preconditioning Table 3 – Temperatures for reflow simulation with different solder paste alloy types |
26 | 5.16.3 Test procedure 5.16.4 Final inspection, measurements, and requirements 5.17 Rapid change of temperature 5.18 Container sealing 5.19 Climatic sequence 5.19.1 General 5.19.2 Dry heat |
27 | 5.19.3 Damp heat, cyclic, test Db, first cycle 5.19.4 Cold 5.19.5 Low air pressure 5.19.6 Damp heat, cyclic, test Db, remaining cycles Table 4 – Number of remaining cycles for damp heat |
28 | 5.20 Damp heat, steady state 5.21 Passive flammability 5.22 Glow wire 5.23 Ball pressure 5.24 Component solvent resistance |
29 | 5.25 Solvent resistance of marking |
30 | Annex A (normative) Measuring points for electrical tests and measurements A.1 General A.2 Foil method A.3 Method for inductors with mounting devices Table A.1 – Measuring points for electrical tests |
31 | A.4 Vblock method Figure A.1 – Examples how to connect electrical tests |
32 | Annex B (normative) Requirements for earth inductors Table B.1 – Minimum copper cross-sectional area of earth inductor’s winding |
33 | Annex C (normative) Example of a suitable circuit for the voltage endurance test Figure C.1 – Test circuit for endurance voltage |
34 | Annex X (informative) Cross-references to the previous edition of this document |
36 | Bibliography |