IEC 60384-21:2019 is available as /2 which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60384-21:2019 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384-14. The object of this document is to prescribe preferred ratings and characteristics and to select from IEC 60384-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements prescribed in detail specifications referring to this sectional specification are of equal or higher performance levels; lower performance levels are not permitted. This edition includes the following significant technical changes with respect to the previous edition: – revision of the structure in accordance with ISO/IEC Directives, Part 2:2016 to the extent practicable, and for harmonizing with IEC 60384-22; – deletion of the description on the permissible reactive power in 6.2.2 because it is not appropriate for the purposes of this document; – the dimensions of 0201M in Annex A have been added.

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PDF Pages	PDF Title
2	undefined
5	Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
6	English CONTENTS
10	FOREWORD
12	1 Scope 2 Normative references 3 Terms and definitions
13	4 Information to be given in a detail specification 4.1 General
14	4.2 Outline drawing and dimensions 4.3 Mounting 4.4 Rating and characteristics 4.4.1 General 4.4.2 Nominal capacitance range 4.4.3 Particular characteristics 4.4.4 Soldering
15	4.5 Marking 5 Marking 5.1 General 5.2 Information for marking 5.3 Marking on the body 5.4 Requirements for marking 5.5 Marking of the packaging 5.6 Additional marking 6 Preferred ratings and characteristics 6.1 Preferred characteristics
16	6.2 Preferred values of ratings 6.2.1 Rated temperature (TR) 6.2.2 Rated voltage (UR) 6.2.3 Category voltage (UC) 6.2.4 Preferred values of nominal capacitance and associated tolerance values Table 1 – Preferred tolerances on nominal capacitance
17	6.2.5 Temperature coefficient (α ) Tables Table 2 – Nominal temperature coefficient and tolerance
18	6.2.6 Dimensions Table 3 – Combination of temperature coefficient and tolerance
19	7 Quality assessment procedures 7.1 Primary stage of manufacture 7.2 Structurally similar components 7.3 Certified records of released lots 7.4 Qualification approval 7.4.1 General 7.4.2 Qualification approval on the basis of the fixed sample size procedures
20	7.4.3 Tests
21	Table 4 – Fixed sample size test plan for qualification approval – Assessment level EZ
22	Table 5 – Tests schedule for qualification approval
25	7.5 Quality conformance inspection 7.5.1 Formation of inspection lots 7.5.2 Test schedule 7.5.3 Delayed delivery 7.5.4 Assessment levels
26	8 Test and measurement procedures 8.1 General 8.2 Preliminary drying Table 6 – Lot-by-lot inspection Table 7 – Periodic tests
27	8.3 Measuring conditions 8.4 Mounting 8.5 Visual examination and check of dimensions 8.5.1 General 8.5.2 Visual examination 8.5.3 Requirements Figure 1 – Fault: crack or fissure Figure 2 – Fault: crack or fissure
28	Figures Figure 3 – Separation or delamination Figure 4 – Exposed electrodes Figure 5 – Principal faces
29	8.6 Electrical tests 8.6.1 Capacitance 8.6.2 Tangent of loss angle (tan δ ) Table 8 – Tangent of loss angle limits
30	8.6.3 Insulation resistance 8.6.4 Voltage proof
31	8.7 Temperature coefficient (α ) and temperature cycle drift 8.7.1 General 8.7.2 Preliminary drying 8.7.3 Measuring conditions 8.7.4 Requirements Table 9 – Test voltages
32	8.8 Shear test 8.9 Substrate bending test 8.9.1 General 8.9.2 Initial measurement 8.9.3 Final inspection 8.10 Resistance to soldering heat 8.10.1 General 8.10.2 Initial measurement 8.10.3 Test conditions Table 10 – Temperature cyclic drift limits
33	Figure 6 – Reflow temperature profile Table 11 – Reflow temperature profiles for Sn-Ag-Cu alloy
34	8.10.4 Recovery 8.10.5 Final inspection, measurements and requirements 8.11 Solderability 8.11.1 General 8.11.2 Test conditions Table 12 – Maximum capacitance change
35	8.11.3 Recovery 8.11.4 Final inspection, measurements and requirements 8.12 Rapid change of temperature 8.12.1 General 8.12.2 Initial measurement 8.12.3 Number of cycles
36	8.12.4 Recovery 8.12.5 Final inspection, measurements and requirements 8.13 Climatic sequence 8.13.1 General 8.13.2 Initial measurement 8.13.3 Dry heat 8.13.4 Damp heat, cyclic, Test Db, first cycle 8.13.5 Cold 8.13.6 Damp heat, cyclic, Test Db, remaining cycles Table 13 – Maximum capacitance change
37	8.13.7 Final inspection, measurements and requirements 8.14 Damp heat, steady state 8.14.1 General 8.14.2 Initial measurement 8.14.3 Test conditions Table 14 – Number of damp heat cycles Table 15 – Final inspection, measurements and requirements
38	8.14.4 Recovery 8.14.5 Final inspection, measurements and requirements 8.15 Endurance 8.15.1 General Table 16 – Test conditions for damp heat, steady state Table 17 – Final inspection, measurements and requirements
39	8.15.2 Initial measurement 8.15.3 Test conditions 8.15.4 Recovery 8.15.5 Final inspection, measurements and requirements Table 18 – Endurance test conditions (UC = UR) Table 19 – Endurance test conditions (UC ≠ UR)
40	8.16 Robustness of terminations (only for capacitors with strip termination) 8.16.1 General 8.16.2 Test conditions 8.16.3 Final inspection and requirements 8.17 Component solvent resistance (if required) 8.18 Solvent resistance of the marking (if required) 8.19 Accelerated damp heat, steady state (if required) 8.19.1 General Table 20 – Final inspection, measurements and requirements
41	8.19.2 Initial measurement 8.19.3 Conditioning 8.19.4 Recovery 8.19.5 Final measurements Table 21 – Initial requirements Table 22 – Conditioning
42	Annex A (normative) Guidance for the specification and coding of dimensions of fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 Figure A.1 – Dimensions Table A.1 – Dimensions
43	Annex B (informative) Combination of temperature coefficient and tolerance for the reference temperature of 25 °C Table B.1 – Combination of temperature coefficient and tolerance for the reference temperature of 25 °C
44	Annex X (informative) Cross-reference for reference to IEC 60384-21:2011 Table X.1 – Reference to IEC 60384-21 for clause/subclause Table X.2 – Reference to IEC 60384-21 for figure/table
45	Bibliography

Status	Withdrawn
Title	Fixed capacitors for use in electronic equipment – Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1
Replaces	BS EN 60384-21:2012
Publisher	BSI
Committee	W/-
Pages	46
Publication Date	2019-03-28
Withdrawn Date	2024-08-08
Replaced By	BS EN IEC 60384-21:2024
ISBN	978 0 580 97411 3
Standard Number	BS EN IEC 60384-21:2019
Identical National Standard Of	IEC 60384-21:2019, EN 60384-21 Ed.3.0, EN 61131-9:2013
Descriptors	Dimensions, Approval testing, Electrical testing, Thermal resistance, Fixed capacitors, Testing conditions, Capacitors, Multiple, Qualification approval, Damp-heat tests, Bend testing, Marking, Shear testing, Electrical tolerances, Rated voltage, Endurance testing, Performance, Inspection, Sampling methods, Laminates, Ratings, Conformity, Ceramics, Assessed quality, Defects
ICS Codes	31.060.10 - Fixed capacitors


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