🔥🔥 Don’t Miss Out on Our End of Autumn Sale. If you have any questions, feel free to click the bottom right corner to contact our customer service..

Concat us[email protected]
Shopping Cart

No products in the cart.

🔍
BS EN IEC 60068-2-20:2021 – TC

BS EN IEC 60068-2-20:2021 – TC

$186.33

Tracked Changes. Environmental testing – Tests. Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

Published By Publication Date Number of Pages
BSI 2021 56
PDF Format Searchable Printable Preview Now
Guaranteed Safe Checkout
Categories: ,

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

IEC 60068-2-20:2021 is available as IEC 60068-2-20:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60068-2-20:2021 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068?2?58. This document provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this document include the solder bath method and soldering iron method. The objective of this document is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering. This edition includes the following significant technical changes with respect to the previous edition: – update of and clarification of pre-conditioning (former “aging”) and its relation to natural aging.

PDF Catalog

PDF Pages PDF Title
30 undefined
33 Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
35 English
CONTENTS
37 FOREWORD
39 1 Scope
2 Normative references
3 Terms and definitions
40 Figure 1 – Diagram of contact angle
41 4 Test Ta: Solderability of wire and tag terminations
4.1 Objective and general description of the test
4.1.1 Test methods
4.1.2 Specimen preparation
42 4.1.3 Initial measurements
4.1.4 Preconditioning
43 4.2 Method 1: Solder bath
4.2.1 General
4.2.2 Description of the solder bath
4.2.3 Flux
4.2.4 Procedure
44 4.2.5 Test conditions
4.2.6 Final measurements and requirements
4.3 Method 2: Soldering iron at 350 °C
4.3.1 General
4.3.2 Description of soldering iron
Table 1 – Solderability, solder bath method: Test severities (duration and temperature)
45 4.3.3 Solder and flux
4.3.4 Procedure
Figure 2 – Position of soldering iron
46 4.3.5 Final measurements and requirements
4.4 Information to be given in the relevant specification
47 5 Test Tb: Resistance to soldering heat
5.1 Objective and general description of the test
5.1.1 Test methods
5.1.2 Initial measurements
5.2 Method 1: Solder bath
5.2.1 Description of the solder bath
5.2.2 Flux
5.2.3 Procedure
48 5.2.4 Test conditions
5.2.5 De-wetting
Table 2 – Resistance to soldering heat, solder bath method:Test severities (duration and temperature)
49 5.3 Method 2: Soldering iron
5.3.1 Description of soldering iron
5.3.2 Solder and flux
5.3.3 Procedure
5.4 Recovery
5.5 Final measurements and requirements
5.6 De-wetting (if required)
50 5.7 Information to be given in the relevant specification
51 Figure A.1 – Example of apparatus
53 Table B.1 – Colophony based flux compositions
54 Bibliography

Related products

BS EN IEC 60068-2-20:2021 - TC
$186.33