BS EN 62374-1:2010:2011 Edition
$102.76
Semiconductor devices – Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Published By | Publication Date | Number of Pages |
BSI | 2011 | 20 |
This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.