BS EN 61192-3:2003

$189.07

Workmanship requirements for soldered electronic assemblies – Through-hole mount assemblies

Published By	Publication Date	Number of Pages
BSI	2003	50

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Description

Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

Additional information

Status	Withdrawn
Pages	50
Publication Date	2003-04-07
Withdrawn Date	2019-05-08
ISBN	0 580 41544 9
Standard Number	BS EN 61192-3:2003
Title	Workmanship requirements for soldered electronic assemblies – Through-hole mount assemblies
Identical National Standard Of	EN 61192-3 (IEC 61192-3:2002) AS, IEC 61192-3:2002
Descriptors	Assessed quality, Printed circuits, Assembling, Soldering, Electronic equipment and components, Laminates, Printed-circuit boards
Publisher	BSI
Committee	EPL/501
ICS Codes	31.190 - Electronic component assemblies

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BS EN 61192-3:2003

$189.07


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