BS EN 60384-19:2015
$167.15
Fixed capacitors for use in electronic equipment – Sectional specification: Fixed metallized polyethylene-terephthalate film dielectric surface mount d.c. capacitors
Published By | Publication Date | Number of Pages |
BSI | 2015 | 36 |
IEC 60384-19:2015 is applicable to fixed surface mount capacitors for direct current, with metallized electrodes and polyethylene-terephthalate dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly onto substrates for hybrid circuits or onto printed boards. These capacitors may have “self-healing properties” depending on conditions of use. They are primarily intended for applications where the a.c. component is small with respect to the rated voltage. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384 14. This edition includes the following significant technical changes with respect to the previous edition: a) Revised all parts of the document based on the IEC Directives Part 2:2011 (sixth edition) to the extent practicable, and harmonization between other similar kind of documents. b) Revised tables and Clause 4 so as to prevent duplications and contradictions.
PDF Catalog
PDF Pages | PDF Title |
---|---|
6 | English CONTENTS |
9 | FOREWORD |
11 | 1 General 1.1 Scope 1.2 Object 1.3 Normative references |
12 | 1.4 Information to be given in a detail specification 1.4.1 General 1.4.2 Outline drawing and dimensions 1.4.3 Mounting 1.4.4 Ratings and characteristics |
13 | 1.4.5 Marking 1.5 Terms and definitions 1.6 Marking 1.6.1 General 1.6.2 Information for marking 1.6.3 Marking on capacitors |
14 | 1.6.4 Marking on packaging 2 Preferred ratings and characteristics 2.1 Preferred characteristics 2.1.1 Preferred climatic categories 2.2 Preferred values of ratings 2.2.1 Nominal capacitance (CN) 2.2.2 Tolerance on nominal capacitance 2.2.3 Rated voltage (UR) |
15 | 2.2.4 Category voltage (UC) 2.2.5 Rated temperature 3 Quality assessment procedures 3.1 Primary stage of manufacture 3.2 Structurally similar components 3.3 Certified test records of released lots 3.4 Qualification approval procedures 3.4.1 General 3.4.2 Qualification approval on the basis of the fixed sample size procedure Tables Table 1 – Percentage limit of the rated voltage at a.c. voltage frequency |
17 | Table 2 – Test and sampling plan for qualification approval Assessment level EZ |
18 | Table 3 – Test schedule for qualification approval (1 of 6) |
23 | 3.5 Quality conformance inspection 3.5.1 Formation of inspection lots |
24 | 3.5.2 Test schedule 3.5.3 Delayed delivery 3.5.4 Assessment levels Table 4 – Lot-by-lot inspection |
25 | 4 Test and measurement procedures 4.1 Mounting 4.2 Visual examination and check of dimensions 4.2.1 General 4.2.2 Visual examination and check of dimensions 4.2.3 Requirements 4.3 Electrical tests 4.3.1 Voltage proof Table 5 – Periodic inspection |
26 | 4.3.2 Capacitance 4.3.3 Tangent of loss angle (tan () Table 6 – Test voltages |
27 | 4.3.4 Insulation resistance Table 7 – Applicable tan δ values |
28 | 4.4 Shear test Table 8 – Requirements regarding insulation resistance Table 9 – Correction factor dependent on temperature |
29 | 4.5 Substrate bending test 4.5.1 General 4.5.2 Initial inspections 4.5.3 Final inspections and requirements 4.6 Resistance to soldering heat 4.6.1 General 4.6.2 Initial inspections 4.6.3 Test conditions 4.6.4 Recovery 4.6.5 Final inspections and requirements 4.7 Solderability 4.7.1 General |
30 | 4.7.2 Test conditions 4.7.3 Final inspections and requirements 4.8 Rapid change of temperature 4.8.1 General 4.8.2 Initial inspections 4.8.3 Test conditions 4.8.4 Final inspections and requirements 4.9 Climatic sequence 4.9.1 General 4.9.2 Initial inspections 4.9.3 Dry heat |
31 | 4.9.4 Damp heat, cyclic, test Db, first cycle 4.9.5 Cold 4.9.6 Damp heat, cyclic, test Db, remaining cycles 4.9.7 Recovery 4.9.8 Final inspections and requirements 4.10 Damp heat, steady state 4.10.1 General 4.10.2 Initial inspections 4.10.3 Test conditions 4.10.4 Recovery 4.10.5 Final inspections and requirements |
32 | 4.11 Endurance 4.11.1 General 4.11.2 Initial inspections 4.11.3 Test conditions 4.11.4 Final inspections and requirements 4.12 Charge and discharge 4.12.1 General 4.12.2 Initial inspections 4.12.3 Test conditions Table 10 – Test conditions |
33 | 4.12.4 Recovery 4.12.5 Final inspections and requirements 4.13 Component solvent resistance (if applicable) 4.14 Solvent resistance of marking (if applicable) |
34 | Bibliography |