ASTM-F692 2002

$40.63

F692-97 Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates

Published By	Publication Date	Number of Pages
ASTM	2002	4

Guaranteed Safe Checkout

Category: ASTM

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

Description

ASTM F692-97

Historical Standard: Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates

ASTM F692

Scope

1.1 This test method covers the determination of the adhesion strength of films to substrates by pulling wires soldered to the films.

1.2 This test method is intended to measure the adhesion of metallization to substrates, and not the strength of the solder.

1.3 This test method applies to all films that can be soldered.

1.4 The maximum melting point of solder used with this test method is determined by the characteristics of the solder flux.

1.5 This test method is destructive.

1.6 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Keywords

adhesion strength; metallization; solderable thick film

ICS Code

ICS Number Code n/a

DOI: 10.1520/F0692-97

Additional information

Standard Title	F692-97 Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates
Published Code	ASTM
Publication Date	2002
Pages Count	4