ASTM-B604 2008
$44.96
B604-91(2008) Standard Specification for Decorative Electroplated Coatings of Copper Plus Nickel Plus Chromium on Plastics
Published By | Publication Date | Number of Pages |
ASTM | 2008 | 11 |
1.1 This specification covers the requirements for several grades and types of electrodeposited copper plus nickel plus chromium coatings on plateable plastic substrates where appearance, durability and resistance to thermal cycling are important to service performance. Five grades of coatings are provided to correlate with the service conditions under which each is expected to provide satisfactory performance.
1.2 This specification covers the requirements for coatings applied subsequent to the application of metal film by autocatalytic deposition or subsequent to the application of any strike coatings after autocatalytic deposition.
1.3 The following caveat pertains only to the test method portions of Section 6, Annex A1, and Appendix X2, Appendix X3, and Appendix X4 of this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
PDF Catalog
PDF Pages | PDF Title |
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1 | Scope Referenced Documents Terminology Classification |
2 | Ordering Information Product Requirements TABLE 1 |
3 | TABLE 2 |
4 | TABLE 3 |
5 | Sampling Requirement A1. Thermal Cycling of Electroplated Plastics A1.1 A1.2 A1.3 A1.4 TABLE A1.1 |
6 | A1.5 X1. DEFINITIONS AND EXAMPLES OF SERVICE CONDITIONS FOR WHICH THE VARIOUS SERVICE CONDITION NUMBERS ARE APPROPRIATE X1.1 X1.2 X1.3 X1.4 X1.5 X2. DETERMINATION OF SULFUR IN ELECTRODEPOSITED NICKEL X2.1 Total Sulfur in Electroplated Nickel by Combustion-Iodate Titration |
8 | X2.2 Determination of Sulfur in Electroplated Nickel by the Evolution Method FIG. X2.1 |
9 | X3. DUCTILITY TEST X3.1 X3.2 X3.3 X4. DETERMINING THE NUMBER OF DISCONTINUITIES IN CHROMIUM ELECTROPLATING (DUBPERNELL TEST) X4.1 X4.2 X4.3 |
10 | X4.4 FIG. X4.1 |