IPC 2225:1998
$37.05
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
| Published By | Publication Date | Number of Pages |
| IPC | 1998-05-01 | 32 |
This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties, relationships with DFM and DFE.
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