BS EN IEC 60317-80:2019
$102.76
Specifications for particular types of winding wires – Polyvinyl acetal enamelled rectangular copper wire, class 120, with a bonding layer
Published By | Publication Date | Number of Pages |
BSI | 2019 | 16 |
This part of IEC 60317 specifies the requirements of enamelled rectangular copper winding wire of class 120 with a dual coating. The underlying coating is based on polyvinyl acetal resin, which can be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The second coating is a bonding layer based on a thermoplastic or thermosetting resin.
NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics.
The range of nominal conductor dimensions covered by this document is:
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width: min. 2,00 mm max. 16,00 mm;
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thickness: min. 0,80 mm max. 5,60 mm.
Wires of grade 1 and grade 2 are included in this specification and apply to the complete range of conductors.
The specified combinations of nominal width and thickness as well as the specified ratio width/thickness are given in IEC 60317-0-2:2019.
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
5 | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications |
7 | English CONTENTS |
8 | FOREWORD |
10 | INTRODUCTION |
11 | 1 Scope 2 Normative references 3 Terms, definitions, general notes and appearance 3.1 Terms and definitions |
12 | 3.2 General notes 3.2.1 Methods of test 3.2.2 Winding wire 3.3 Appearance 4 Dimensions 4.1 Conductor dimensions 4.2 Enamel layer 4.3 Bonding layer 5 Electrical resistance 6 Elongation 7 Springiness |
13 | 8 Flexibility and adherence 8.1 Mandrel winding test 8.2 Adherence test 9 Heat shock 10 Cut-through 11 Resistance to abrasion 12 Resistance to solvents 13 Breakdown voltage 14 Continuity of insulation 15 Temperature index Table 1 – Mandrel winding |
14 | 16 Resistance to refrigerants 17 Solderability 18 Heat or solvent bonding 18.1 Heat bonding 18.1.1 Room temperature 18.1.2 Elevated temperature 18.2 Solvent bonding 19 Dielectric dissipation factor 20 Resistance to transformer oil 21 Loss of mass 23 Pin hole test 30 Packaging |
15 | Bibliography |