BS EN 61191-2:2017:2019 Edition

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Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies

Published By	Publication Date	Number of Pages
BSI	2019	40

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Description

This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through- hole, chip mounting, terminal mounting, etc.).

Additional information

Status	Definitive
Title	Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies
Corrects	BS EN 61191-2:2017
Replaces	BS EN 61191-2:2013
Publisher	BSI
Committee	EPL/501
Pages	40
Publication Date	2019-10-07
ISBN	978 0 539 06624 1
Standard Number	BS EN 61191-2:2017
Identical National Standard Of	EN 61191-2:2017, IEC 61191-2:2017/COR1:2019, IEC 61191-2:2017/COR1:2019
Descriptors	Printed-circuit boards, Printed circuits, Solders, Soldering, Classification systems, Surface properties, Position, Boards, Electrical equipment, Semiconductor devices, Electronic equipment and components, Electrical components, Microassembling, Joints, Integrated circuits
ICS Codes	31.190 - Electronic component assemblies

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BS EN 61191-2:2017:2019 Edition

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